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XTEC Modular System For Power & Data Application for Packaging & Printing Industry

 XTEC Modular System For Power & Data Application for Packaging & Printing Industry

Intercontec's Xtec system has been designed to deliver a system that offers perfect modularity - the world's first truly modular industrial interconnect system, allowing both power & signal systems to be created.
XTEC Modular System For Power & Data Application for Packaging & Printing Industry

Visit the AP Technology Ltd website for more information on XTEC Modular System For Power & Data Application for Packaging & Printing Industry

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