VAC745 / VAC765 Solder Equipment

VAC745 / VAC765 Solder Equipment

Void-free solder joints with highest qualityMaximum board sizes:VAC745: 635 x 444mmVAC765: 635 x 644mmSpecial Features15? touch Windows HMI Screen (Network Capability)Vacuum process in the vapour phase for void-free soldering ( patented)Automatic monitoring of vacuum process (pressure monitoring)IPS Intelligent profilling systemTRS temperature recording and analysis softwaPilot mode (PCB- temperature recording and Analysis software) Pilot-mode (PCB-Temperatute controlled process
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