PoP Package on Package

The demand to design products using PoP technology (Package on Package) is increasing rapidly from customers involved in hand held products, such as mobile communications, PDA, tablet and camera based technology. Based at Aldershot our leading edge production facility can support product assembly with package on package technology (PoP). Using leading edge PCB manufacturing tools, such as our MYDATA solder jet printer allows our customers to easily access this technology. Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows a much higher component density on PCB design to be used. Electrically, PoP offers benefits by minimising track length between different interoperating parts, such as a controller and a memory. This yields better electrical performance of devices, since shorter routing of interconnections between circuits yields faster signal propagation and reduced noise and cross-talk. Using our MYDATA solder jet printing technology, with it's highly controlled Z-height, paste deposits can be printed to PCB’s and ASICC logic dies during the same manufacturing cycle. Our highly flexible MYDATA chip placers can accurately place stacked memory dies to form the PoP assembly. Our facility uses automated handling to mirror large-scale volume assembly, in addition to a bespoke thermal profile NPI process we provide additional process checking such as, X-ray, camera inspection, X-J tag and AOI inspection. We manufacture products with PoP devices for rapid prototype to medium batch production orders. Our service is suitable for a wide variety of products, such as niche applications of 1-1000 batch sizes, short product life cycles, development boards and NPI prior to mass volume manufacture.