Anisotropic Conductive Die Attach Adhesives

Anisotropic Conductive Adhesive Key Features

Conduct only in the vertical, or Z-axis, planeHigh bond strengthUltra-fast thermode-curing in seconds Very small particle size (~ 5µm) to endure no conductivity in X & Y planesHigh glass transition temperature (Tg) of ~ 150°C

With excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, LCP, PETP, etc.) and an extended working life (up to 7 days for one particular adhesive), DELO's anisotropic conductive die attach adhesives are ideal for flip-chip and BGA component bonding.

These adhesives are particularly suitable for RFID applications, where reliable bonds must be achieved in seconds on temperature-sensitive substrates such as PET and paper. Smart labels, i.e. a label with a built-in chip and an antenna, transfer data from an RFID chip to a reader, resulting in an easy, automatic and contact-free process.

DELO MONOPOX anisotropic adhesives have very low water absorbtion rates, so they are highly resistant to humidity, resulting in reliable, secure bonds between the die and the substrate. In addition, they have been optimised for syringe dispensing, so can be used in manual to fully-automitc placement equipment.

More detailed information on DELO's range of die attach adhesives can be found here.

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Technical Downloads

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DELO Smart Bonds in RFID Technology Brochure

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DELO MONOPOX AC245 Technical Data Sheet

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DELO MONOPOX AC268 Technical Data Sheet

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DELO MONOPOX AC6530 Technical Data Sheet

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DELO MONOPOX AC6545 Technical Data Sheet

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DELO Bonding in Electronics Brochure

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