Menu

Benchtop Plasma Cleaner: PE-50XL

PE-50XL Key Features

Continuously adjustable power rangeParallel plate electrode for optimum plasmaPLC control with simple adjustment of stored parametersOptional plasma etching 13.56MHz RF sourceFor processing up to 175mm (7?) samples

The Plasma Etch, Inc. PE-50XL has all the features as the PE-50, however it comes with a 200w x 225d x 100h mm (8? w x 9? d x 4? h) chamber for those looking to process larger applications. The system features an implosion proof rectangular welded Aluminium Vacuum Chamber and a direct powered RF electrode for optimum cleaning and etching.

The PE-50XL was developed to process parts for smaller production facilities, R&D facilities and Universities. Applications include cleaning or stripping medical devices, solar cells, printed circuit boards, connectors, MEMs, nanotechnology, wafer level packaging, as well as many other related semiconductor processes.

PE-50XL features include:

Durable Welded Aluminium Vacuum ChamberChamber Dimensions: 200x225x100mm (8?x9?x4?)Single 175x200mm RF Powered Electrode400W, 50KHz Continuously Variable Power Supply2 Rotometer Gas Control 0-25cc/minPirani Vacuum Gauge, 0-1TorrPLC Microprocessor Control SystemKeypad user interface with alphanumeric displayStorage of one Process RecipeAutomatic Process Sequencing5 CFM Oxygen Service Vacuum PumpPump footprint 175x400mm (7" x 16")Console Dimensions: 350x350x450mm (14x14x18?)Approximate Shipping weight is 45KgElectrical: 230/240VAC, 14A

Options:

5 CFM 2-Stage Direct Drive Oil Vacuum Pump150W, 13.56MHz Generator & Automatic Matching NetworkLight Status Traffic Light BarMass Flow Meter

PreviousNext

PE-50XL Technical Downloads

File

PE-50XL Datasheet

Download

Visit the Inseto (UK) Ltd website for more information on Benchtop Plasma Cleaner: PE-50XL

ENQUIRY FORM

More Products

  • XB8 Wafer Bonder

  • Wire Pull & Bond Shear Tester: Dage 4000 Optima

  • XBS200 Wafer Bonder

  • Wire Pull Test: Microelectronic Devices