Dual Cured Adhesive: DELO Dualbond

DELO Dualbond Key Features

Dual cured adhesivesInitial cure with light for handling or securingFull cure with light or heat or moistureIdeal for applications with shadow zonesOptimum placement accuracy - no movement during secondary cureExcellent adhesion to many substrate materials

DELO DUALBOND dual cured adhesive are one-part adhesives suitable for bonding, sealing and potting applications. Based on either epoxy or acrylate chemistry, they have good resistance to thermal shock, and some products are optically clear for large-area bonding, especially suitable for display assembly.

They use a combination of light (UV or VIS) and either heat or humidity to achieve full cure. They are used in applications that require a very quick initial handling strength, with full cure being achieved off-line or in a subsequent process where cycle time is not so critical (e.g. in-line reflow ovens).

Using high-intensity light to fix the components in place eliminates any potential for movement of the parts relative to each other during the secondary heat or humidity cure.

Example dual cured adhesive applications include sealing compact camera modules, bonding RFID and smart labels and general applications in electronic assembly or other industries, which require short cycle times.

An example of an application that has been solved using a DELO DUALBOND dual cured adhesive can be found here. For information on choosing and working with dual-curing adhesives, please look at our Knowledge Base Fact Sheet here.

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DELO Dualbond Technical Downloads

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DELO DUALBOND - Dual Cured Adhesive Selection Chart

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DELO KATIOBOND / DELO DUALBOND Selection Chart

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DELO MONOPOX / DUALBOND Selection Chart

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DELO Light Curing Brochure

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DELO LED Curing Lamps Overview

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