MA100/150e Gen2 Automatic Mask Aligner

MA100/150e Gen2 Key Features

High Volume Automated Mask AlignerOptimised for up to 100 (4?) or 150mm (6?) wafersSimultaneous handling of 3 wafers allows > 145 wafer per hourAlignment functions for scribed, transparent or textured wafersSUSS Diffraction Reducing Optics for optimal print resolutionNon-contact Pre-Align & Flat FindersProcess Single Wafers or Wafers on Carrier Substrates

The SUSS Microtec MA100/150e Gen2 was developed to support various high volume market segments, such as HB-LEDs, Compound Semiconductors, Power Devices and RF-MEMS.

The system is optimised for wafers up to 150mm in diameter and offers exceptional process scalability with an industry leading throughput of 145 wafers per hour; including alignment and exposure times.

Alignment accuracy of < � 0.7um is readily achievable with the SUSS Microtec Direct-Align function, while the optional BSA can achieve < �1.5um.

For scribe line applications, SUSS Microtec have a sophisticated "Line Alignment" function for precise alignment of pre-scribed glass wafers to the photo mask, without need of traditional wafer targets.

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MA100/150e Gen2 Automatic Mask Aligner Technical Downloads

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SUSS MicroTec MA100/150e Gen2 Series Mask Aligner Datasheet

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