Nickel Bond Dicing Blade

Nickel Bond Dicing Blade Key Features

The Nickel binder provides superior blade life and lower wear rateIdeal for soft material applications such as: PCB, Silicon and BGAThe thinnest blade available, down to .0008"Excellent rigidity for higher exposureBlade thickness up to 0.020? milDiamond grit size ranges from 2-4 microns to 70 microns

Annular Nickel Bond Dicing Blade from ADT are produced using a state-of-the-art, tightly controlled electro-forming process, which guarantees a uniform distribution of diamonds throughout the Nickel layer. This process not only allows for blades to be produced to very tight tolerances but also permits optimization of grit size, hardness and geometry to meet the particular requirements of your application.

The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA's.

Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size) and diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness).

Please contact us with your specific application or dicing blade requirements.

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Nickel Blade Technical Downloads

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Dicing Process Handling Tips

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ADT - Nickel Bond Dicing Blades Brochure

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