Semiautomatic Dicing Series 7120 / 7130

7120/7130 Series Key Features

Available with either 2? and 4? dicing spindlesAdvanced automatic vision alignment capabilitiesDesigned for high reliability and low maintenancePrecision structure for superior accuracy and repeat-abilityIncreased yield, throughput and process controlUnique multi-panel processing capabilitiesSpecial blade wear forecast algorithmUser-friendly software platform

ADT's 7120 Series of Semiautomatic Dicing Systems for 50-200mm devices, cover the full spectrum of dicing materials from IC wafers to multi-panel dicing of pcb packages and hard material applications. The systems offers the lowest possible cost-of-ownership, whilst providing the most advanced dicing technology.

Featuring front mount high precision air bearing spindles, with options for 2?, 3?, 4? and 5? dicing blades for thin through thick devices, the systems are capable of cutting or scribing up to 8? x 8? area.

The various models are equipped with close loop turn table and optimized for variety of products such as: Silicon wafers, Thin-film devices, High-brightness LED Packages, SAW Filters, Glass/Silicon, PZT, ceramics and more.

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7122 Technical Downloads

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7120-30 Series Dicing Systems

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Principles of Dicing

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