Semiautomatic Large Area Dicing Systems

7120/7130 Series Key Features

Series of large dicing systems for up to 450x600mm devicesUnique multi-panel processing capabilitiesAdvanced hardware platform for high reliability & low maintenanceHigh & low power Spindle optionsCustomized chucks configurationsIncreased theta precision for high accuracy over long cut lengthsSpacious load & unload area for large substrates

ADT produce a range of high-precision large area dicing systems for processing up to 300mm (12?) wafers, in addition to the cutting of large PCB substrates or hard and brittle glass and ceramic substrates. Whilst the 7100XLA model can handle even larger substrates, PCB and other devices up to 450x600mm in size. All systems are available with either 2? or 4? spindles.

For cutting hard and thick materials, the systems include high power 4?, DC-brushless, 2.5 kW, Air-bearing Spindles (30 krpm Max.), with closed-loop turntable. These are optimised for high-precision, multi-panel dicing of thick applications up to 450 mm x 600 mm panels etc.

For processing up to 300mm silicon wafers, the systems feature front mount 2? air bearing spindles for up to 1.2KW at 60krpm. A DC Brushless motor provides close-loop speed control. These models are compatible with 2? - 3? hub and annular blades.

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7120/7130 Large Area Dicer Technical Downloads

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7120-30 Series Dicing Systems

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Principles of Dicing

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