Solder Jetting Systems

Solder Jetting Systems Key Features

Solder Jetting of SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi soldersFlux-free reflow with laserSolder ball diameter 100 - 760µmBall rework & (de-balling & re-balling) capabilitySingle-step solder ball placement and laser reflowNo tooling (mask, stencil) or Flux requiredNo mechanical or thermal stressNo additional reflow required

PacTech manufacture manual, semi-automatic and fully automated solder jetting systems for low through high volume applications.

PacTech offers two different equipment platforms for solder ball deposition using their Laser Assisted Solder Jetting (SB�) technology for MEMS, aerospace and medical applications; as well as single die, probe cards, substrates, hard disc drive heads and camera modules. All systems offer both standard and jetting mode processes.

The SB�-Jet range are designed for mass production applications whereas the SB� M and SB� SM platforms are ideal for R&D , prototyping and low volume production requirements.

See our "Knowledge Base Document" for a guide to the basics of how solder ball jetting technology works.

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Solder Jetting Systems

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SB2-M: Dedicated for prototype and rework applications.

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SB2-SM: Semiautomatic stand alone system for low-medium volume production.

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SB2-JET: Fully automatic for large volume manufacturing, in line or stand alone.

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