High Density Interconnect PCB's

Invotec offer engineering solutions designed to align the customer design requirements to the correct interconnect solution. We take into consideration the cost, manufacturing complexity and working environment.

One of the areas we specialise in is High Density Interconnect (HDI).
This involves the following areas

- Microvia.
- Sequential lamination.
- Depth drilling.
- Composite builds.
- Complex Flexi / Rigid.