Thermal Compound 52130 - Silicone-free Thermal Interface Material

Thermal Compound 52130 synthetic non-silicone thermal grease solves the problems of contamination and migration associated with silicone-based products. It is recommended for high-temperature heat transfer in silicone-sensitive applications and vacuum environments. The product offers high thermal conductivity with minimal bleed and evaporation over a wide operating temperature range. Features *************************************************** • Non-metallic filler • Continuous operation exceeding 200° C • Non-flammable and oxidation resistant • Minimal outgassing and bleed Benefits *************************************************** • Moderate thermal conductivity at lower cost • Non-flammable and oxidation resistant • High performing in vacuum environment • Non-hazardous Typical Applications ************************************************** • Intentional heat source, such as heating element, calrod, etc., that requires continuous operation at temperatures exceeding 200° C The Non-Silicone Advantage ************************** The no-creep feature extends circuit life by protecting components longer and eliminating premature failures caused by migrating fluid. Silicone-based compounds have an undesirable tendency to physically migrate and contaminate nearby components. This contamination can interfere with circuit operation long after hardware installation to cause unexpected and often inaccessible problems.