PCB Solder Leveller

The Panels are passed through the flux machine, which cleans the exposed copper leave a layer of flux on the panels.

This enables the tin lead to adhere to the copper. The panel is then placed on the arms of the Solder Leveller machine.

This machine has a tank of melted tin-lead, into which the panel is inserted vertically for a set amount of time. This ensures that the tin-lead covers all the exposed copper. The panel is then withdrawn at a set speed, and compressed air is passed over it to remove excess tin-lead giving a finish of 10-15 microns.

Finally, the panel is passed through a washer system to remove any excess flux.