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Wire Bonding Services

We work closely with our customers at the package design stage to ensure that design for manufacturing techniques are applied and wire bond design rules, where possible, are adhered to. This co-design activity is crucial in the development a high yield, fully automated and fully optimized wire bond process.

Visit the Optocap Ltd. website for more information on Wire Bonding Services

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  • Prototype To Production

  • Microelectronic Assembly

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