Soldered Fin Heat Sinks

DAU SF heat sinks now offer the design engineer the possibility to dissipate extremely high power on small volume heat sinks.

The especially developed solder technique creates an excellent interface between the copper baseplate and the tin plated copper fins which has no measureable thermal resistance.

Due to the termal conductivity of copper being practically 2 times better than aluminium, the fin efficiency of the SF heat sinks is much higher than other types. Basically all requested fin heights are available, but increasing the heights of the fins without a reasonable increase to the ambient temperature serves no useful purpose. Therefore Series SF allows smaller heatsinks or higher power losses with same size