BGA Inspection Services

X-Ray Inspection

Pre reflow

The problem associated with soldering BGA's to boards have to do with the invisibility of the joint on a ball by ball basis.

The use of X-Ray is one of the tools Prima uses to confirm the integrity of the pasting process.

The grey scale image of an array of balls which shows where the ball is relative to the pads in the solder paste gives a fair indication of the alignment or otherwise of the placement or the registration of the paste on the pads.

This technique is used to determine the potential integrity of the joint before the button is pushed to go reflow the batch.

Post reflow

The soldering process can in of itself cause registration or alignment issues but also create voids inside the collapsed solder ball. It is important to be able to examine BGA's post reflow to ensure that they have been put down correctly, at least visibly.

Further tools such as flying probe and boundary scan are used later in the process to electrically test the joints and to supplement the visible results shown by X-Ray