Vapour Phase Soldering

Vapour phase and reflow soldering

One of the most critical elements of board build is the reflow of the solder paste to form a good, consistent and reliable solder joint between the part and the bare board. Getting control of this element of the process is therefore vital to ensure a defect free board.

Vapour Phase

Recognising that conventional reflow techniques are not always the best to use for lead free boards Prima has invested in Vapour Phase soldering.

The technique of immersing the board in the vapour allows the vapour at higher temperatures to penetrate every nook and cranny of a solder joint and give an even temperature distribution in and around the solder joint at the moment of reflow of the solder paste. Because this happens in an inert atmosphere, this provides a more consistant and reliable solder joint.

Control of reflow

With forced air reflow soldering it is important to have consistant temperature control in the heating zones so that correct ramp up and ramp down profiles can be achieved.

The Essemtec reflow oven used by Prima provides all these facilities for both lead free and leaded boards