Bespoke Chip-On-Board Technology Solutions

Are you looking for Bespoke Chip-On-Board Technology Solutions? We are here to help! Our Bespoke Chip-On-Board Technology Solutions provides features for creation and annotation of die & bond pads and bond wires. It also allows automatic placing bond pads around the die. To know more about our Bespoke Chip-On-Board Technology Solutions, please give us a call on +44 (0) 1684 296551!