Packaging & IC Assembly
Our European Packaging line, located in Toulouse, allows us to deliver fast-run prototypes or small series in following packages :Plastic moulded : QFN's, SOIC, QFP's, DIP's
Air cavity / Premoulded plastic : QFN's, SOIC's, QFP's, DIP's �
Ceramics (ceramic or metal lid) �
Metal packages : TO's �
Organic packages: BGA, LGA
Visit the Synergie-Cad (UK) Ltd website for more information on Packaging & IC Assembly