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Packaging & IC Assembly

Our European Packaging line, located in Toulouse, allows us to deliver fast-run prototypes or small series in following packages :

Plastic moulded : QFN's, SOIC, QFP's, DIP's
Air cavity / Premoulded plastic : QFN's, SOIC's, QFP's, DIP's �
Ceramics (ceramic or metal lid) �
Metal packages : TO's �
Organic packages: BGA, LGA

Visit the Synergie-Cad (UK) Ltd website for more information on Packaging & IC Assembly

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