2018FLEX Japan Targets Flexible Hybrid Electronics Technology and Applications

2018FLEX Japan, the leading Flexible Hybrid Electronics (FHE) conference and exhibition in Japan, will assemble top experts April 19-20, 2018, in Tokyo for the latest in both flexible electronics and MEMS and sensors. For the first time, the event will co-locate with the MEMS & Sensors Forum to spotlight FHE and MEMS and sensors technologies and enabling applications ranging from Internet of Things (IoT) to medtech in the Japan region. Registration for the event is now open. The two-day event offers two networking events for innovation, partnership and business opportunities, as well as four technical sessions: FHE and Printed Electronics IoT Applications MEMS and Sensors Textiles The four sessions will feature 16 FHE technologists and experts from Japan, America, Asia and Europe representing organizations and academia including: Jeremy Burroughes, CTO, Cambridge Display Technology Ltd. Bair Wilfried, senior engineering manager, NextFlex Michael D. McCreary, vice president and CTO, E Ink Corporation Jam Khan, vice president, Professional Service & Business Development, Software Monetization, Gemalto N.V. Ichiro Amimori, co-founder and CEO, Xenoma Inc. Shuichi Gennaka, general manager, Development Dept. Technical Center general manager, Suminoe Textile Co., Ltd. Simon Jones, commercial director, FlexEnable Limited 2018FLEX Japan will also showcase tabletop exhibits by FHE, MEMS and sensors manufacturing supply chain players and electronics companies integrating these technologies. Additional information is available here and at Customer Services, SEMI Japan – jcustomer@semi.org; +81.3.3222.5988.