Low Pressure Moulding Services
Low Pressure Overmoulding encapsulates as well as protects PCB & Cable Assemblies. It is an innovative encapsulation process which is positioned between traditional potting and injection moulding technologies. It is a complimentary technology which does not replace all potting applications and commonly doesn't compete with traditional injection moulding.
Visit the EC Electronics Ltd website for more information on Low Pressure Moulding Services
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