Turnkey Assembly

We offer total solution manufacturing packages which include the following contract manufacturing services: • Chip-on-board (COB) wire bonding • Surface-mount-technology (SMT) • Quad Flat No Leads(QFN) package • Ball-grid-array (BGA and micro BGA) • Pb free and Rohs compliance process • Plastic injection molding • Sheet metal stamping • Die casting • Silk-screening, pad-printing, painting and powder coating • Functional testing, ICT testing, X-Ray inspection, automatic optical inspection (AOI) • New product introduction process (NPI) • Full Procurement