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Optocap Ltd offers contract package design & assembly services for microelectronic and optoelectronic devices.

Our expertise in packaging solutions spans the complete product life-cycle: from design through protyping, process optimisation, product qualification, failure analysis, volume manufacturing and transfer to low-cost volume manufacture. This offers customers adopting an outsourced manufacturing model with a much simplified and efficient supply chain.

Products

  • Custom Lens Design

  • Encapsulation and Hermetic Sealing

  • Environmental Testing

  • Epoxy Die Attach Services

  • Failure Analysis

  • Fiber Alignment

  • Flip Chip Bonding

  • Microelectronic Assembly

  • Microfocus Xray

  • Optical Design

Optocap Ltd. has 20 items listed - You are viewing 1 - 10 of 20 Products

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News

  • Optocap recruiting for Engineers and Operators

  • Optocap Ltd to exhibit at Laser World of Photonics 2011

  • Optocap to attend UK Semiconductors 2011 Conference and Exhibition

  • Optocap will be attending the UK Semiconductors 2012 Conference and Exhibition

Optocap Ltd. has 4 items listed - You are viewing 1 - 4 of 4 News

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