Oxley High Density Arrays Save Size and Weight

There is a global necessity for smaller and lighter devices and this has led to an increase in demand for Micro D high-contact density interconnects. Weight and size are very important factors in missile, aerospace and man portable applications, where the reduction of these can lead to a massive increase in performance. The bulkhead connector, with its excellent ground path, is the only natural place to house the RFI filtering, and Oxley have been offering innovative and reliable filtering on MIL-DTL-83513 planform layouts for many years. In-house manufacture of capacitive filter elements and metalwork allows customisation of performance requirements to meet any and all demands. A tight control can be kept on cost and lead times thanks in to the design, test, tool room, machine shop and plating facilities that we have in-house at Oxley. Oxley Micro D Planar Arrays and assemblies have a 1.27mm contact pitch and hence a 50% smaller footprint than equivalent ARINC arrays for the same number of contacts. Using the Oxley ‘spring contact’ design protects the ceramic array from mechanical and thermal stress and removes any need for difficult soldering operations. The Micro D arrays can be supplied with compliant grounding strips or fully assembled into a modified connector or custom housing. The same size 26 vias can be placed on custom layouts, including circular arrays. The Development EMC Manager of Business Development, Mark Johnson, says “This range of products gives the customer the benefits of freeing up space and weight for other components, fuel or munitions but allows them to avoid the very fine assembly work required by the close pitching of the contacts”. OX-PR 140