Application-Specific PCB Manufacturing For HAST
Application-Specific PCB Manufacturing For HASTConsidered within the semiconductor industry as the fast and effective alternative to Temperature Humidity Bias testing (THB), Highly-Accelerated Temperature and Humidity Stress Test (HAST) is a critical part of the device package Qualification process and is used to evaluate the reliability of non-hermetic packaged devices in humid environments.
Visit the Reltech Ltd website for more information on Application-Specific PCB Manufacturing For HAST