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Application-Specific PCB Manufacturing For HAST

Application-Specific PCB Manufacturing For HAST

Considered within the semiconductor industry as the fast and effective alternative to Temperature Humidity Bias testing (THB), Highly-Accelerated Temperature and Humidity Stress Test (HAST) is a critical part of the device package Qualification process and is used to evaluate the reliability of non-hermetic packaged devices in humid environments.

Visit the Reltech Ltd website for more information on Application-Specific PCB Manufacturing For HAST

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