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Infra Reflow Assembly Simulation Services

Infra Reflow Assembly Simulation Services

Preconditioning is performed prior to package level reliability testing to simulate the effects of board assembly on non-hermetic� devices where moisture may have been absorbed during normal storage. The subsequent exposure to high temperature during infra reflow assembly can cause internal damage such as "pop corning" and delamination.

Visit the Reltech Ltd website for more information on Infra Reflow Assembly Simulation Services

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