Menu

Preconditioning Services For Package Level Reliability Testing

Preconditioning Services For Package Level Reliability Testing

Preconditioning is performed prior to package level reliability testing to simulate the effects of board assembly on non-hermetic� devices where moisture may have been absorbed during normal storage. The subsequent exposure to high temperature during infra reflow assembly can cause internal damage such as "pop corning" and delamination.
ENQUIRY FORM

More Products

  • Device-Specific PTC Testing Solutions

  • Mission Critical Device Testing Services

  • Space Application Device Testing Solutions

  • Military Device Qualification Services