Lead Free Solder Paste
Solder PasteLead Free Solder Paste
VTP500-FLY905 is a mildly activated resin-based formula designed specifically to allow post-process residues to be left on the PCB without degradation.
• Wide reflow process window
• Mildly activated resin-based formulation designed specifically to allow post process residues to be left on the PCB without degradation.
• 12 hour stencil life
• 6 hour tack time
• High humidity resistance
• Good slump resistance
• Low temperature reflow peak process window 221 - 235°C
• 6 hour tack time
• High humidity resistance
• Good slump resistance
• Low temperature reflow peak process window 221 - 235°C
Visit the Vigortronix Ltd website for more information on Lead Free Solder Paste
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