Circuit board manufacturing

We know our customers have a wide range of Circuit board manufacturing requirements. Our Circuit board manufacturing capabilities include: Conventional through hole assemblies BGA (Ball grid arrays) Circuit board manufacturing capabilities are supported with: Forced hot air convection reflow and Optical inspection facilities. Automated solder paste dispensing, Screen printing, We can handle components down to 0402 in size Our Circuit board manufacturing soldering capabilities include: Hand soldering with highly trained operatives for very low volume or complex situations. The latest wave soldering machines The latest reflow soldering capability All are available with lead-free soldering (RoHS compliant) or traditional tin / lead soldering.