CoreTest adds Temperature Forcing Equipment
18-09-2011
CoreTest Technologies Ltd. adds the FlexTC Bench top Temperature Forcing System from Mechanical Devices to its portfolio. The FlexTC is a revolution in temperature testing for semiconductor devices. It is powered from a regular power socket, a dry LN2 or Air source at 0.2 Bar is required as a purge when running cold. It can cool from -45 to +135 degrees C and takes 2 minutes to go from 20 to -30. Unlike similar equipments no liquids are used in the system which could damage test heads and boards.
Chris Rogalski said 'The FlexTC is a perfect match to the range of semiconductor test equipment we offer. It is an outstanding piece of equipment and is the best in its class.'
'CoreTest the ideal company to market our products. They have extensive contacts in the semconductor and PCB test arenas. We look forward to a sucessful working relationship with them.' said Chen Goldner.
CoreTest will sell this in the regions UK, Ireland, Scandinavia and Benelux.
'CoreTest the ideal company to market our products. They have extensive contacts in the semconductor and PCB test arenas. We look forward to a sucessful working relationship with them.' said Chen Goldner.
CoreTest will sell this in the regions UK, Ireland, Scandinavia and Benelux.
Visit the CoreTest Technologies Ltd. website for more information on CoreTest adds Temperature Forcing Equipment
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